Explore News
Electronics News
Events
Industry 4.0
Trade Associations
Magazine
Five Indium Corporation Experts to Present at IPC APEX Expo
Indium Corporation’s technical experts will share a variety of presentations on topics ranging from e-Mobility, achieving low voiding through solder preforms, high-performance metal thermal...
Emil Otto Will Not Use Any Alcohol Declared as “Bio-alcohol” Due to Sustainability
Many industries, especially the chemical industry, want to produce end products in a more sustainable way. In some cases, seemingly sustainably produced preliminary products...
Indium Corporation Introduces New Key HR Team Member
Indium Corporation is pleased to announce that Christine Potocki has joined the company as Strategic Human Resources (HR) Business Partner – International Integration.
In this...
New to the Market: Light-Curable Materials for Consumer Electronics Wearable Devices
Dymax, a leading manufacturer of rapid-curing materials and equipment, is pleased to release its 9200-W series of next-generation light-curable encapsulants and structural and optical-positioning...
Seika Announces New Options and Features for SAYAKA PCB Routers
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services is pleased to announce new options and features available for stock...
DELO Offers a New Adhesive for Closed-cavity Packaging
DELO has developed a new, reliable sealant adhesive for CMOS image sensors, which are often used in driver monitoring systems. Glass filters can be...
Indium Corporation Expert to Present at Wafer-Level Packaging Symposium
Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation by Dr. Dongkai Shangguan, strategic advisor, at the Surface...
Cosmo Films Ltd. Launches White Cast Polypropylene (CPP) Film
Cosmo Films Ltd., a global leader in specialty films for flexible packaging, labeling and lamination applications as well as synthetic paper, has launched a...
MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding...
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, announces the release of...
SHENMAO to Highlight High-Rel Solder Sphere and Thermal Fatigue Resistant Paste at APEX
SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan....
