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World’s First Commercially Available Diamond Filled Underfill: SMT 158D8
YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast flowing, and an...
Indium Corporation Announces Reflow Fundamentals Webinar
Indium Corporation’s Kim Flanagan, Technical Support Engineer, will host an InSIDER Series webinar on reflow fundamentals in two sessions on Wednesday, Feb. 10 at...
KYZEN Strengthens Florida Presence with Kurt Whitlock Associates
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, announces that it has partnered with Kurt Whitlock Associates. Under the new partnership, Kurt...
MicroCare Receives FDA Registration for Stereze™ Hand Sanitizing Solutions
MicroCare LLC, experts in critical cleaning solutions, has announced that it has received registration from the U.S. Food and Drug Administration (FDA) for its...
MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding...
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, announces the release of...
Plasmatreat Opens Subsidiary in Switzerland
Plasmatreat GmbH, technology leader in industrial atmospheric plasma surface treatment, has further developed its international proximity to its customers in 2020 by founding the...
Ventec Strengthens Canada OEM Activities with Appointment of Sigma Component Design
Ventec International Group Co., Ltd. (6672 TT) today announced the appointment of Sigma Component Design (Sigma) to provide sales and support to OEM customers...
First Compostable Electrostatic Dissipating Anti-Corrosion Film in the World!
EcoCortec® is pleased to announce the world’s first Eco-Corr Film® ESD - biodegradable, compostable static dissipative films and bags powered by “Nano” VpCI®. This...
