NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at NEPCON Vietnam September 11-13^th at booth U05, or visit www.aimsolder.com.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.

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Fan-Out Packaging: Powering the AI Era

The AI revolution continues to push the boundaries of computing power, driving the demand for high-performance AI chips, which in turn is accelerating innovation in advanced packaging. The fan-out process is shaping the future of semiconductor manufacturing, and ASMPT is at the forefront of this trend with its high-density Fan-Out Panel-Level Packaging (FOPLP) solution designed for 2.5D, fan-out, and embedded packages. NUCLEUS XLplus is precisely engineered to meet SEMI 3D20 standards, and it delivers exceptional accuracy on SiP bonding and flexibility in the fan-out process. Capable of handling extra-large substrates up to 600 x 600 mm, the solution supports a wide range of packaging configurations, from flip-chip to direct die attach, which exemplifies ASMPT’s dedication to pioneering technology and innovation in the rapidly evolving advanced packaging industry.

Smart Automotive Solutions: Driving the Future

AI is widely adopted by electric vehicle manufacturers for advanced driver assistance systems, autonomous driving features, and predictive maintenance, enabling enhanced performance, safety, and efficiency. To meet the dynamic needs of the automotive sector, ASMPT will present a range of Smart Automotive solutions tailored for the industry, encompassing sensing tech, power management, connectivity, infotainment, and more. ASMPT will also present the SiC power and advanced display solution, empowering EV manufacturers to improve quality, reliability, and efficiency in their production operations.

• POWER VECTOR – a die-tacking solution designed for Ag/Cu sintering in automotive power modules, offering strong bonding forces up to 588 N and process versatility. Coupled with ASMPT’s SiC power solution, manufacturers can create robust modules with enhanced electrical and thermal characteristics.
• VORTEX II – designed explicitly for Mini LED Advanced Displays, efficiently handling Mini LED assembly and offering high-speed performance, exceptional precision, and innovative Zero-Delay XY-auto-correction, tending to transform visual experiences in modern vehicles with enhanced display quality and performances.

Intelligent Factory: Elevating Digital Transformation to New Heights

As the premier supplier of cutting-edge equipment and technological processes for the electronics industry, ASMPT enables electronics manufacturers worldwide to establish smart factories, championing automation and digitalisation. Through AI Enablement with machine learning algorithms incorporating the 4M framework (Man, Machine, Materials, Method), ASMPT solutions offer decision automation and optimisation, seamlessly integrating all operational levels from individual machines to production lines, factories, and enterprises. ASMPT’s comprehensive smart manufacturing solutions include SkyEye, the ecosystem for smart semiconductor manufacturing, and Intelligent Factory solutions, alongside its innovative SIPLACE placement and DEK printing solutions, as well as the modern Manufacturing Execution Systems (MES) from Critical Manufacturing will be displayed at SEMICON Taiwan. Together, this dynamic platform of advanced technologies will illustrate the latest automation and Digital Transformation advancements.

“ASMPT’s presence at SEMICON Taiwan 2024 reflects our commitment to leading the industry with our developments and providing innovative solutions for semiconductor and electronics manufacturing. ASMPT will showcase its latest innovations in advanced packaging, smart automotive solutions and smart manufacturing, highlighting its leading role in semiconductor and electronics manufacturing technology. This will further strengthen our collaboration with our customers and partners and reinforce our role as a trusted industry leader that increases productivity, efficiency and competitiveness, “ reassures Joseph Poh Tson Cheong, Senior Vice President at ASMPT.

About SEMICON Taiwan 2024, please visit the official website: www.semicontaiwan.org.

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As an industry expert in printed circuit board assembly (PCBA), Selectronic Assembly will showcase its extensive capabilities in delivering high-quality manufacturing solutions across a wide range of industries. Selectronic Assembly serves diverse markets, including automotive, medical, industrial, energy, and communication networks. The company’s commitment to quality, efficiency, and customer satisfaction has positioned it as a trusted partner for clients requiring reliable and innovative EMS solutions.

Selectronic Assembly’s state-of-the-art facility is equipped with the latest technology to ensure that all products meet the highest industry standards. The company is proud to hold IPC 610 and ISO 9001:2015 certification, reflecting its commitment to maintaining rigorous quality control and continuous improvement in its processes.

During the Binational Electronics Show, attendees will have the opportunity to learn more about Selectronic Assembly’s customized services, which are designed to meet the unique needs of each client. The company’s advanced manufacturing processes and highly skilled workforce enable it to deliver exceptional results, ensuring that products are manufactured to the most exacting standards.

Visit Selectronic Assembly at the Binational Electronics Show to discover how the company can provide the expertise and innovation needed to drive success in your electronic manufacturing projects. For more information about Selectronic Assembly’s services, please visit www.selectronicassembly.com.

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Featured Systems at Kyushu Semiconductor Industry 2024:

MARS System
PEMTRON’s MARS system is a high-speed Automated Visual Inspection (AVI) solution specifically engineered for memory modules. Known for its precision and reliability, the MARS system leverages advanced image processing technology to deliver accurate inspection results at exceptional speeds. Its robust design ensures consistent performance, making it an indispensable tool for memory module manufacturers looking to enhance quality control and boost production efficiency.

APOLLON System

The APOLLON system is tailored for comprehensive package inspection and supports a wide range of package types, including BGA, LGA, QFN, QFP, CSP, and SOP. APOLLON excels in real-time defect identification and automated reporting, significantly improving manufacturing efficiency and minimizing production downtime. By swiftly detecting and addressing defects, the system helps maintain the highest standards of quality throughout the packaging process.

8800WI Wafer Inspection System
The 8800WI wafer inspection system employs advanced 2D and 3D imaging technologies to inspect various types of bumps, including micro bumps. This system is critical for identifying and resolving quality issues early in the semiconductor manufacturing process. Its cutting-edge imaging capabilities allow for detailed inspection, ensuring that even the smallest defects are detected and corrected.

Experience PEMTRON’s Innovative Solutions:

Visitors to PEMTRON’s booth at Kyushu Semiconductor Industry 2024 can experience live demonstrations of these cutting-edge inspection systems. The booth will feature videos showcasing the equipment in action, providing an in-depth look at how PEMTRON’s solutions are revolutionizing semiconductor inspection.

Don’t miss the opportunity to see how PEMTRON is shaping the future of semiconductor manufacturing with its innovative inspection technologies. For more information about PEMTRON, please visit www.pemtron.com.

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At the show, KIC will launch its groundbreaking Thermal Analysis System software featuring the new OEE (Overall Equipment Effectiveness) feature and the Common Recipe Finder. These innovations are designed to provide manufacturers with actionable insights, enabling them to not only “see where they’re going” but also to “know where they’ve been.” KIC’s solutions are engineered to enhance production efficiency, quality, and sustainability in the electronics manufacturing industry.

Key Exhibits at Elektronikmessen E-24:

KIC Smart Profiler System (SPS):

• See Where You’re Going – Process and Recipe Setup:
  • Fast NPI: Accelerate product launch cycles with rapid and precise profiling.
  • High Reliability and Quality: Ensure consistent product quality with optimized recipes.
  • OEE: Improve equipment performance and minimize downtime with common recipes.
  • High Volume Manufacturing: Optimize for maximum throughput and efficiency.
  • Sustainability: Reduce energy consumption and carbon footprint with eco-friendly practices.

Automatic Profiling During Production:

• Know Where You’ve Been – Value-Add, Cost-Effective Automatic Profiling:
  • Automatic Profiling: Streamline profiling processes for cost-effective operations.
  • Oven Performance Tracking: Monitor and enhance oven performance with real-time data.
  • Traceability: Achieve full traceability with detailed reports and data tracking.
  • Easy Audit Reports: Simplify compliance and audit procedures with intuitive reporting tools.
  • Process Control: Maintain optimal process conditions for superior results.
  • MES/CFX/Hermes Integration: Seamlessly integrate with Manufacturing Execution Systems and communication standards.

Visit KIC at Booth C-4632 to experience firsthand how their smart factory ecosystem helps customers achieve faster NPI, higher quality and reliability, increased volume and productivity, reduced energy consumption, and improved overall equipment effectiveness (OEE). KIC’s innovative solutions are designed to empower businesses to drive continuous improvement and achieve their production goals with precision.

For more information about KIC, visit www.kicthermal.com.

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Technological change has been progressing ever more rapidly for years and is having a major impact on the world of work. Advances in the areas of digitalization and Artificial Intelligence (AI) are creating new opportunities: for example, work processes can be automated as well as accelerated and new innovations can be implemented. However, these changes also bring new challenges: many companies are finding it increasingly difficult to find suitable skilled workers with the necessary skills and knowledge to meet the demands of modern industry. The consequences of this shortage of skilled labour are manifold: production delays, an additional workload for the existing workforce, financial losses and reduced competitiveness.

In this context, training and further education programmes are becoming increasingly important. Rehm Thermal Systems, a global manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems and numerous customized special systems for the electronics industry, recognized the importance of lifelong learning at an early stage and actively invested in the development of its own employees and customer employees in order to successfully meet the challenges of the future. And its success proves it right: as in previous years, some user trainings can no longer be booked for the current year.

The “new” Rehm Academy

In order to be able to further expand the portfolio in the coming years and counteract long waiting times, the company has decided to move the Rehm Academy to a larger adjoining building. With over 800 m² spread over two floors, the new premises at the company headquarters in Blaubeuren-Seissen offer optimal conditions for practical learning: five training rooms with modern equipment and two machine rooms with different Rehm systems. The offer includes user trainings as well as course solutions in the area of software.

User trainings – practical and application-orientated

The user trainings teach both theoretical content from the field of process technology and practical skills relating to operation and maintenance. The trainers always focus on the individual process requirements and work scenarios. This guarantees that the customer receives optimum support for the specific requirements of production. Customized user trainings are also available on request at the customer’s premises.

The Rehm Academy currently offers one- or two-day user trainings for various systems (Vision Series [with vacuum option], Condenso Series, Protecto Series and RDS Drying Systems). The training courses can be booked for users in different roles.

Expertise for modern industry

Industrial companies are faced with the challenge of optimizing their processes, increasing efficiency and at the same time reacting flexibly to market changes. Software solutions play a decisive role here. They not only enable the automation of processes, but also provide valuable insights through data analyses and support decision-making at all levels.

Due to the expansion of the Rehm Academy in terms of space and personnel, new software training courses on the following topics can be offered from September:

ViCON / six hours of face-to-face training

With ViCON, Rehm Thermal Systems has designed and realized software that meets all the requirements of modern, networked and, above all, future-oriented electronics production: the ViCON software impresses with a variety of analysis tools, the highest quality and the ability to access the software with different devices. The software is also intuitive to use thanks to the use of touch elements and gestures. All messages, commands and parameters are visible in the main mask with machine view.

The training offered looks at the topic of disaster recovery and examines in detail backup solutions, system recovery after replacing a defective SSD, importing an image backup as well as importing and exporting a ViCON backup.

Hermes / one hour of face-to-face training

Efficiency, simplicity, adaptation to demand and networking are the keywords that characterize today’s industry. In a smart factory, it is essential that the entire production process is networked and that all process data and assembly data can be accessed at any time: “the Hermes Standard” is the successor to the SMEMA interface. It ensures that important assembly information is reliably transmitted from machine to machine (M2M) and to higher-level systems – regardless of the manufacturer of the systems in an SMT line.

The training course of the Rehm Academy deals with the basics, functionality, operation and advantages of this interface as well as the variants and options.

MES mit ROI oder CFX / four hours of face-to-face training

In the age of digitalization, manufacturing companies are increasingly relying on process-oriented production management systems (MES). These systems continuously collect all operating data along the material flow for an individual production line and make it available to the higher-level enterprise resource planning system (ERP) via an interface (ROI/CFX).

This course covers the basics and importance of MES systems and the ROI/CFX standard in modern manufacturing. It also looks at how MES systems interact and exchange data with other Industry 4.0 components, including ROI/CFX. And it deals with methods for collecting, processing and analyzing production data through MES, transmission via ROI/CFX, the use of MES and ROI/CFX to optimize manufacturing processes and increase production efficiency and the use of MES and ROI/CFX to improve product quality and compliance with industry standards.

You are interested or have questions?

As part of this year’s Technology Days, Rehm Thermal Systems is offering guided tours through the new Rehm Academy premises on 11 and 12 September 2024. All important information about the event and registration can be found online at www.rehm-group.com/technology-days.html.

Alternatively, you are welcome to contact Ms Annalena Weiss, Organizational Manager Rehm Academy, on +49 7344 9606-433 or by e-mail at a.weiss@rehm-group.com.

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Real-time concentrations of chemistries including AQUANOX A4618 can be effectively monitored by the KYZEN Process Control System.

AQUANOX A4618 is an aqueous cleaning chemistry designed to address the challenges of cleaning the latest lead-free flux residues, including no-clean and Pb-free residues, while achieving mirrored solder finishes. A4618 has a low cost of ownership, an adjusted stabilizer, and cleans successfully at low concentrations and temperatures.

The KYZEN Process Control System controls, monitors and automatically reacts to the dynamic changes in wash concentrations allowing users to maximize high-quality output from inline cleaning systems. KYZEN has continuously improved and advanced the capabilities of the KYZEN PCS from its introduction more than 20 years ago, and it remains the only complete concentration monitoring and control system available in the world.

KYZEN proudly develops and provides chemistries to meet a variety of unique cleaning challenges while providing the tools and systems to accurately measure and control those chemistries for an effective cleaning process.

For more information, visit www.kyzen.com.

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KYZEN provides cleaning solutions for every phase of PCB production with easy-to-use and effective cleaning solutions like KYZEN E5631J and AQUANOX A4618.

KYZEN E5631J is a ready-to-use alternative to IPA for removing all types of raw solder paste from stencils in online and offline stencil cleaning processes to ensure every print counts. The proven compatibility of E5631J covers an array of common stencils, cleaning equipment and printer manufacturers.

AQUANOX A4618 is a low VOC aqueous cleaning chemistry designed to address the challenges of cleaning the latest lead-free flux residues including no-clean and Pb-free residues. A4618 is effective at lower concentrations and temperatures in addition to proving safe for multi-pass applications.

For more than 30 years, KYZEN has met unique cleaning challenges in a variety of PCB production processes by developing and providing innovative and effective chemistries like KYZEN E5631J and AQUANOX A4618.

For more information, visit www.kyzen.com.

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Paul Kim, PVA’s Asia-Pacific Sales Manager, will be in attendance offering insights into PVA’s latest technologies and solutions. Visitors will have the opportunity to discuss PVA’s comprehensive range of high-precision dispensing and conformal coating systems, designed to meet the demanding requirements of the electronics manufacturing industry.

PVA’s automated systems are recognized for their accuracy, repeatability, and reliability, making them essential for a wide range of applications in electronics, aerospace, automotive, and medical device manufacturing. At productronica India, PVA will highlight its expertise in delivering tailored solutions that enhance manufacturing efficiency, reduce costs, and improve product quality.

Whether you are looking to optimize your production processes or explore new application possibilities, PVA’s team will be available to discuss your specific needs and how their solutions can help achieve your manufacturing goals.

Join PVA and Maxim SMT Technologies at SEMICON India (H3.O36) to discover how PVA’s innovative solutions can elevate your manufacturing capabilities.

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.

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NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Ohio Valley Expo & Tech Forum on August 29th, or visit www.aimsolder.com.

The post AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Ohio Valley Expo & Tech Forum appeared first on SMT Today.