MARS System

The MARS system is a high-speed memory module AVI (Automated Visual Inspection) system, renowned for its precision and reliability even in challenging environments. Utilizing advanced image processing technology, MARS delivers accurate inspection results at remarkable speeds. Its robust design ensures consistent performance, making it an invaluable tool for memory module manufacturers looking to enhance quality control and production efficiency.

APOLLON System

For package inspection, PEMTRON offers the APOLLON system, designed to accommodate a wide range of packages including BGA, LGA, QFN, QFP, CSP, and SOP. APOLLON excels in real-time defect identification and automated reporting, which significantly enhances manufacturing efficiency and minimizes downtime. This system ensures that defects are detected and addressed promptly, thus maintaining high standards of quality throughout the packaging process.

8800WI Wafer Inspection System

PEMTRON will also showcase the 8800WI wafer inspection system, which utilizes advanced 2D and 3D imaging technologies to inspect various types of bumps, including micro bumps. The 8800WI plays a crucial role in identifying and addressing quality issues early in the semiconductor manufacturing process. Its cutting-edge imaging capabilities allow for detailed inspection, ensuring that even the smallest defects are caught and rectified.

Visitors to PEMTRON’s booth can experience live demonstrations of these cutting-edge inspection systems on monitors featuring videos of the equipment in action. Don’t miss the opportunity to learn more about how PEMTRON’s solutions are shaping the future of semiconductor inspection. Visit booth #P5606 at SEMICON Taiwan to explore the MARS, APOLLON, and 8800WI systems firsthand and discover how they can elevate your manufacturing operations.

For more information about PEMTRON, please visit www.pemtron.com.

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Registration is open for the Advanced Packaging Conference (APC) and Fab Management Forum (FMF).

Co-located with productronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain and featuring a live exhibition and programs.

Advanced Packaging Conference ─ Packaging Innovations Enabling Sustainable Applications

Sustainability is vital to the semiconductor industry growth on its path to $1 trillion, with electrification, renewable energy, connectivity, and AI playing crucial roles. Collaboration and innovation across the semiconductor supply chain will be essential to fueling sustainability.

This year’s Advanced Packaging Conference (APC) will focus on:

• Megatrends and Opportunities for Advanced Packaging and Front-End Integration
• Smarter Supply Chain Solutions for A Sustainable Ecosystem
• Testing and Reliability
• System in Package (SiP) Requirements for Future Applications
• Power Electronics Packaging

Speakers include experts from AT&S, Atotech an MKS Brand, Cohu, Comet Yxlon, Elmos Semiconductor, Evatec, Fraunhofer Institutes, GlobalFoundries, Henkel, imec, Infineon Technologies, JCET Group, Koh Young Europe, Merck, ProSys, STMicroelectronics, and TSMC.

The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, Merck, Panasonic Connect and Resonac Europe.

Fab Management Forum ─ Strategies for Succeeding Sustainable Growth

Long-term strategies are essential to improving resilience across the European semiconductor supply chain.

This year’s Fab Management Forum (FMF) will focus on:

• Fab Expansion Landscape: Opportunities and Challenges
• Industrial Collaboration Models
• Poster Session: Industry Meets Innovative Ideas
• Cultivating the Workforce of Tomorrow
• Solutions Enabling the Path to Net Zero
• Smarter Manufacturing for a Connected Ecosystem

Speakers include experts from Applied Materials, D-SIMLAB Technologies, INFICON, Infineon Technologies, Intel, Qualcomm, Robert Bosch, Schneider Electric, STMicroelectronics, Texas Instruments, Tokyo Electron Europe, Watlow, Wolfspeed, and X-FAB.

The forum is sponsored by Comet Yxlon, Edwards, Flexciton, INFICON, Sachsen-Anhalt, Schneider Electric, Tokyo Electron Europe (TEL), and Watlow.

Other SEMICON Europa 2023 Highlights

• Opening Ceremony will include keynotes by industry leaders from Cadence, CEA-Leti, Comet Group, Edwards, and imec.
• ITF Towards Net Zero – Powered by imec will explore the environmental impact and resource consumption challenges faced by the semiconductor industry.
• ALD TechDay – Powered by Beneq will feature keynotes from Yole Intelligence, Beneq and imec on innovative Atomic Layer Deposition (ALD)
• Executive Forum Program will delve into semiconductor industry topics such as Smart Mobility, Smart MedTech, Smart and Green Manufacturing, materials innovation, electrification and power semiconductors. The program will also feature a fireside discussion with thought leaders from Wolfspeed and ATREG.
• TechARENA Program will address themes including geopolitics, public policy European-funded projects, workforce development, the future of computing and integrated photonics. The program will also include the European premiere of the Chip in, a documentary featuring three twentysomethings on a tour to explore careers in microelectronics, and a discussion on sustainability innovations with leaders from SCREEN.

Programs in halls B1 and B2 are complimentary for all SEMICON Europa and productronica visitors. For more details, please visit the SEMICON Europa 2023 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

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In order to efficiently measure and monitor the distribution and transfer of chemicals and other liquids within a fab, SONOTEC developed the highly accurate SEMIFLOW flow meter series to meet the special requirements of the semiconductor market. The state-of-the-art sensor series can be applied, e.g., to measure the slurry dispensing in CMP processes as well as to monitor the filling volume of etching procedures in wet bench lines. The industry leader in ultrasonic non-contact measurement technology shows its broad product range of precise and reliable non-contact flow sensors and air bubble detectors at the trade show on-site.

Since its first successful steps in the semiconductor market several years ago, SONOTEC has established a strong and loyal customer base as well as strategic distribution partnerships worldwide. Considering recent investment decisions of well-known global players to build new fabs or to enlarge existing manufacturing capacities in Germany, the sensor specialist is encouraged to strengthen its focus on the semiconductor market. Thus, SONOTEC intensifies the cooperation with customers to continuously improve the SEMIFLOW flow meter series in order to customize the sensors for further highly specialized manufacturing processes. Additionally, the ultrasonic specialist continuously expands its team to meet the increasing number of inquiries for flow measurement from the industry.

As an active member of Silicon Saxony, the innovative high-tech network for microelectronics, smart systems, and software, SONOTEC is connected with leading-edge and pioneering technology companies to move the semiconductor market to the next level. “In the coming years, we can anticipate significant advancements in the semiconductor market, driven by innovations for high-performance devices used for electro mobility, digitization, and the aim to achieve higher efficiencies and top performance. These developments will require more precise and efficient flow measurement solutions, enhancing the performance and reliability of semiconductor manufacturing processes while also contributing to sustainability efforts in the industry”, evaluates Anika Baumhauer, International Strategy and Sales Manager at SONOTEC.

SEMIFLOW flow sensors reliably measure abrasive, adherent, corrosive, and ultra-pure liquids on industry-specific rigid plastic tubes and pipes. The clamp-on contact-free architecture eliminates any risk of contamination and leakage. Hence, the ultrasonic sensors are suitable for highly sensitive semiconductor manufacturing processes requiring highest accuracy and process stability. Additionally, the contactless measurement method does not cause any wear or tear for the sensor; the clamp-on ultrasonic sensors are maintenance-free.

The robust sensor design allows a long product life cycle and their minimal power consumption ensures low operating costs. Thus, the non-contact flow meters can contribute to sustainability strategies in the fabs. The SEMIFLOW sensors are also characterized by their compact housing design with integrated electronics. They require little space in the plant and can be easily integrated into existing process chains and architectures. SONOTEC offers the SEMIFLOW series in different sizes to cover a wide range of diameters of PFA, PTFE and other hard plastic tubing.

In order to ensure accurate flow measurement in hazardous environments, SONOTEC developed the SEMIFLOW CO.66 PI Ex1 sensor series. The intrinsically safe ultrasonic flow meters are designed for safe operation in production areas classified as Zone 1 according to ATEX/IECEx. The sensors are protected against explosion hazards caused by gases and vapors according to the standards of gas group IIB; the equipment protection level (EPL) is “Gb”.

Meet SONOTEC and its partner S3 Alliance at SEMICON Europa in Munich from November 14-17, 2023 at booth #B1907 in hall B1.

To learn more, visit www.sonotec.eu.

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At the Taipei Nangang Exhibition Center from September 6 to 8, Solvay’s exhibit at Booth Q5848 will focus on cost-efficient and sustainable material solutions from advanced polymers to slurry abrasives, gases and wet chemicals – all engineered to meet the unique and complex needs of manufacturers in this dynamic market and push the limits of chip performance with outstanding purity, long-lasting chemical stability and optimized resistance to high temperatures and plasma.

“We have made significant investments to demonstrate our firm commitment to Taiwan’s market players which serve the local and global semiconductors industry and are proud to share the latest material innovations for more profitable and sustainable processes covering all semiconductors manufacturing stages”, says Andrew Lau, Senior Executive Vice President of Solvay’s Specialty Polymers Global Business Unit. “Our R&D, production and support capacities are all targeted at delivering the high-performance solutions needed for next-generation processes in line with the semiconductors manufacturing roadmap.”

Based on extensive technical industry experience, Solvay is an acknowledged leader in specialty polymers and chemicals for the semiconductors industry that have proven their superior resistance to the harsh conditions of cutting-edge semiconductor processes. Designed to meet the most demanding performance requirements, they deliver efficient synergies and help manufacturers reduce their carbon footprint at each process step, including front-end-of-line (FEOL), back-end-of-line (BEOL), testing, and assembly.

On display at Solvay’s booth, selected structural and internal parts molded in KetaSpire^® PEEK, Torlon^® PAI, Halar^® ECTFE, and Solef^® PVDF demonstrate the value Solvay’s specialty polymers bring to FEOL processes such as dry and wet etching, cleaning, chemical vapor deposition (CVD), chemical mechanical planarization (CMP) and lithography. Furthermore, Tecnoflon^® FFKM, used for O-rings and seals, Fomblin^® PFPE which serves as a lubricant in vacuum pumps, and Galden^® PFPE which ensures proper heat transfer in chillers will also be highlighted.

Solvay will also present several material solutions with an advanced sustainability profile. New bio-based polymer chemistry addresses ambitious environmental targets. Non-fluorosurfactant (NFS) Tecnoflon^® FKM and more sustainably produced Tecnoflon^® FFKM elastomers show excellent plasma resistance for dry etch seal fabrication and a wide service temperature range, while exhibiting extremely low particle generation. And Halar^® ECTFE grades provide a more sustainable alternative to PFA and PTFE for wet process applications.

Many of Solvay’s specialty polymers also extend into wafer handling, duct coating, filters, piping and tubing as well as BEOL processes from wafer level packaging (WLP) to probing and testing. The portfolio is complemented by dedicated specialty chemicals such as cleaning gas for etching, Interox^® hydrogen peroxide (H2O2) for optimized wet etching and Cypure^® PH3 cylindered phosphine dopant gas. All of these process chemicals, including fluids with very low global warming potential, offer the highest levels of purity, quality and consistency in the market.

In line with the company’s continuing efforts to ensure the long-term supply security of its specialty chemicals, Solvay has invested in a new joint venture plant for the production of electronic-grade H2O2, an indispensable chemical agent in wafer cleaning. Located at Tainan Technology Industry Park, the plant is scheduled for commissioning in the fourth quarter of 2023 with an initial capacity of 30,000 tons per year. It builds on Solvay’s experience with other H2O2 plants already operating in Asia, Europe and the United States and complies with strict international standards of quality, sustainability and environmental safety.

For more information, visit www.solvay.com.

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BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will highlight its TrueFlat reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.

“Very thin substrates represent a special challenge for thermal processing,” said Joe Yang, product manager at BTU. “Our TrueFlat technology ensures that even substrates as thin as 0.15 mm are kept flat throughout the entire reflow process.”

Part of the industry-leading Pyramax reflow oven platform, TrueFlat technology addresses the critical challenge of substrate warpage. One of the standout features of the TrueFlat is its exceptional thermal uniformity, made possible by integrating the Pyramax’s closed-loop convection heating system. By eliminating die tilt and accommodating substrate thicknesses ranging from 0.15-0.30 mm, TrueFlat technology maximizes process yield.

Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary Wincon Windows-based software including factory host/MES interface for Industry 4.0 compliance. This innovative configuration enables manufacturers to achieve reliable and optimal results across a range of applications.

Visit BTU International’s booth at SEMICON Taiwan 2023. To learn more visit www.btu.com.

About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market.  BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion and sintering. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia, and Europe. Information about BTU International is available at www.btu.com.

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Nordson TEST & INSPECTION today announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The company will be showcasing its state-of-the-art inspection and metrology solutions, including the CyberOptics SQ3000+ Multi-Function system, the new Quadra 7 Pro Manual X-ray Inspection (MXI) System, and the revolutionary WaferSense® Auto Teaching System (ATS2). The event will take place from Sept. 6-8, 2023 at TaiNEX 1&2 in Taipei.

The new Quadra 7 Pro MXI system sets a new standard for 3D/2D manual inspection in back-end semiconductor applications. Powered by the revolutionary Onyx® detector technology, it delivers exceptional image clarity and reduced noise levels, elevating the inspection experience to new levels of precision and efficiency.

Equipped with the latest Dual Mode Quadra NT4® tube, the Quadra 7 Pro provides users with maximum flexibility. This innovative feature offers brightness and resolution modes, allowing operators to dynamically switch between them based on specific application requirements.

Enhancing the Quadra 7 Pro’s capabilities is the newly developed Revalution software, tailored specifically for high-end semiconductor applications. With an intuitive interface, optimized workflow, and expanded functionality, Revalution software empowers operators to efficiently analyze and interpret inspection data, contributing to faster decision-making and improved overall productivity.

The CyberOptics SQ3000+ Multi-Function system is designed for high-end applications, catering to industries such as advanced packaging, mini-LED, advanced SMT, and 008004/0201 SPI. This all-in-one solution offers unmatched accuracy and high speed, utilizing an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that effectively eliminates reflection-based distortions caused by shiny components and specular surfaces.

The WaferSense® Auto Teaching System (ATS2) is a multi-camera sensor that, when used in conjunction with CyberSpectrum software, enables accurate wafer hand-off calibration for semiconductor tool alignment and setup for front-end semiconductor fab environments. With the ability to capture three-dimensional offset data (x, y, and z) in real-time, ATS2 simplifies wafer position teaching without the need to open the tools. This results in repeatable and reproducible setups, streamlined maintenance checks, accelerated troubleshooting, and reduced technician-to-technician variation, leading to significant yield improvements and enhanced productivity for semiconductor fabs worldwide.

To witness the future of advanced inspection and metrology technology, visit booth #L0800 on the 4^th floor at SEMICON Taiwan 2023, and explore Nordson TEST & INSPECTION’s range of industry-leading solutions.

For more information, visit www.nordson.com.

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• The popular ASYMTEK Vantage^® fluid dispensing system, Nordson’s most advanced dispensing platform, is designed for high-end semiconductor packaging and assembly. Fast and accurate, the Vantage, when configured with dual IntelliJet® valves, can jet into gaps less than 200 um, and up to 90,000 dots per hour.
• The newest ASYMTEK Forte^® fluid dispensing system offers exceptional dispensing productivity and accuracy for high-volume consumer electronics, flexible circuit, MEMs, and electromechanical applications.
• Both systems offer fine-line dispensing capabilities to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly.

Experts will be ready to discuss how Nordson can support your operations for reliable electronic products. SEMICON Taiwan will be held at Taipei Nangang Exhibition Center, Taipei Taiwan, September 6-8, 2023.

About Nordson Electronics Solutions

Nordson Electronics Solutions makes reliable electronics an everyday reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world’s semiconductor, printed circuit board, and precision assembly manufacturers with the innovative fluid dispensing and surface treatment solutions they need to protect sensitive electronics. Day after day, year after year, across the globe, for 40 years, we’ve delivered cutting-edge engineering and applications excellence to help our customers succeed. 

About Nordson Corporation

Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics, and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at www.nordson.com.

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TRI’s AI-powered AOI solutions for the Semiconductor and Advanced Packaging Industry can inspect Die and Wire Bonding, wafer surface and bumps, epoxy, and foreign material detection.

For the first time, TRI will be exhibiting the Wafer Inspection Platform, TR7950Q SII, equipped with a state-of-the-art mechanical structure, an optimal 2.5 µm high resolution, with an outstanding 25MP camera. The TR7950Q SII is equipped with an innovative optical module for the inspection of highly reflective surfaces, specialized for Wafer Inspection.

TRI will showcase the latest 3D SPI with a 3.5 µm high-resolution 25MP Camera, TR7007Q SII, and the AI-powered 3D AOI, TR7700Q SII, with the improved 25MP 2.5 µm configuration. The TR7007Q SII and the TR7700Q SII represent TRI’s latest inspection innovations for the Advanced Packaging and Semiconductor Industry. The lineup will also include an X-ray Inspection Demo Station and TRI’s innovative AI Solutions, which include the AI Station, AI Training Tool, and the AI Verify Host.

Visit TRI’s Booth No. I2800 at SEMICON Taiwan 2023 to learn more about TRI’s SEMI applications and the latest innovations in Test and Inspection for the Advanced Packaging Industry.

For more information, please visit www.tri.com.tw.

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Delivering compact yet powerful electronic devices

The semiconductor advanced packaging industry is at the forefront of meeting the growing demands for highly sophisticated and intricate electronic products utilized in a wide range of applications, including 5G communications, Internet of Things (IoT), augmented reality (AR), smart wearables, electric vehicles, and various consumer and industrial sectors. With a relentless focus on achieving superior performance and compactness, the industry is continuously pushing the boundaries by increasing the component density within semiconductor packages, such as the system-in-package (SiP), while simultaneously reducing the overall package size.

Heraeus Electronics’ solution:

Welco AP520: This state-of-the-art water-soluble type 7 printing paste is designed to solve the challenges of miniaturization, as it can create tiny and reliable joints with close to zero defects. With excellent paste release down to 90 µm pitch (55 µm stencil opening and 35 µm line spacing), no splashing and best-in-class low void performance, AP520 makes an excellent choice for fine-pitch components and flip chip attach for next-generation System-in-Package applications used in 5G communications, smart-wearables, and electric vehicles.

Development of defect-free HPC systems

High-Performance Computing (HPC) has become increasingly integral to everyday life, powering a range of applications including processors for Artificial Intelligence (AI), gaming computers and consoles, 5G smartphones, autonomous driving systems, memory controllers, and more. The key enabling technology for HPC lies in high bump-count and fine bump-pitch flip chips, which require reliable soldering onto substrates. However, the semiconductor industry faces significant challenges in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, and others.

Heraeus Electronics’ solution:

AP500X: This water-soluble, halogen-free tacky flux is specifically engineered for ultra-fine bump-pitch flip chip attach and BGA attach applications. This new carefully designed flux plays an important part in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. in advanced semiconductor packages for high performance computing, memory, mobile and more.

Heraeus’ solution for EMI shielding in 5G technology

Offering accurate selective coating without any masking is the key benefit of the Prexonics® full system solution for EMI shielding on package level. This new technology is the first to enable a thickness aspect ratio of 1:1 at topside and sidewalls and thus only 1.5-2μm conductive film on topside is needed to achieve the required shielding performance. Prexonics® is a unique full system solution offered by Heraeus Printed Electronics, that consists of a special particle-free silver ink, an inkjet printer, and a manufacturing process that uses inkjet printing to apply full, partial or trench coating. This approach allows selective and precise deposition of the silver ink onto specific areas of the component, avoiding excess material and minimizing waste. By using the specialized silver ink customized thin metallization films are possible in the range of 150nm to 4µm.

Finally, Heraeus Electronics will announce its extended product portfolio towards sustainability initiatives with gold bonding wire made with 100% recycled gold and Welco solder paste series made with 100% recycled tin. By incorporating recycled tin or gold into our products, Heraeus Electronics contributes to environmental sustainability, significantly reducing energy consumption and carbon footprint. The pastes formulated with recycled tin maintain the same level of quality as those made with primary tin. Both recycled and non-recycled gold undergo the same meticulous refining process before being transformed into final products, including gold wires and gold-coated silver bonding wires. This ensures the consistent composition & properties across our offerings. Both Heraeus Electronics’ gold and tin suppliers comply with Responsible Materials Initiatives (RMI) and ISO14021:2016.

The Heraeus team also will conduct five live booth presentations that will discuss the company’s newly launched products, and show how its latest materials can further elevate your device performance.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com

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5G communication increases bandwidth, reduces latency and provides faster switching speed. RF amplifiers are critical for 5G high-speed switching. With WBG semiconductors, operating temperature increases above 175°C affecting reliability negatively. Higher temperature can have negative effects on efficiency and also can reduce both performance and reliability.

Heraeus Electronics will display three of its newest products that offer solutions to thermal dissipation, miniaturization, and defect challenges: mAgic® DA320, Welco AP520 and AP500X.

mAgic® DA320 is a high shear strength, non-pressure dispensing sinter paste for die attach of power applications. The new sinter paste, featuring fast sintering, high shear strength and high thermal conductivity, is ideal for Silicon Carbide (SiC), Gallium Nitride (GaN) and other top-of-the-line power devices.

Welco AP520 is a state-of-the-art water-soluble type 7 printing paste designed to solve the challenges of miniaturization, as it can create tiny and reliable joints with close to zero defects. With excellent paste release down to 90 µm pitch (55 µm stencil opening and 35 µm line spacing), no splashing and best-in-class low void performance, AP520 makes an excellent choice for fine-pitch components and flip chip attach for next-generation System-in-Package applications used in 5G communications, smart-wearables, and electric vehicles.

AP500X is a water-soluble, halogen-free tacky flux specifically engineered for ultra-fine bump-pitch flip chip attach and BGA attach applications. This new carefully designed flux plays an important part in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. in advanced semiconductor packages for high performance computing, memory, mobile and more.

As part of its drive to achieve greater sustainability, Heraeus Electronics offers an extended product portfolio with gold bonding wire made with 100 percent recycled gold and Welco solder paste series made with 100 percent recycled tin. Both gold and tin suppliers comply with Responsible Materials Initiatives (RMI) and IS014021:2016. Heraeus Materials Singapore also is certified with UL2809 in accordance with IS014021:2016.

With the latest materials portfolio and technical know-how, Heraeus Electronics is prepared to support customers in response to trends and challenges for EV (Electric Vehicles), 5G communications, IoT (Internet of things), AI (Artificial Intelligence), HPC (High Performance Computing) and environmental sustainability.

Visit Heraeus in booth C762 at SEMICON Korea to explore more.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com.

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