Europlacer, a leading provider of SMT assembly solutions, is pleased to announce its upcoming High-Mix Productivity Open Days to be held at its factory in France this June. This exclusive event will offer valuable insights into the latest innovations in electronics manufacturing and assembly processes, providing attendees with a unique opportunity to enhance their operations. The event will be split into two dedicated weeks: International Open Days from June 18-20, 2024 (English-speaking) and French Open Days from June 21-23, 2024.

Attendees can expect a comprehensive agenda packed with highlights tailored to improve productivity and efficiency in high-mix manufacturing environments:

• Modern Programming Tools: Experience a seamless process from CAD to production with Siemens Valor MSSPP, ensuring optimized programming for enhanced efficiency.
• Fully Connected ii-Tab Preparation: Explore Europlacer’s ii-N1 and ii-N2 machines, designed to streamline machine running and maximize productivity in high-mix production settings.
• Round Table Discussion: Engage with industry leaders from across Europe as we address the latest productivity challenges facing manufacturers in 2024.
• IPC CFX® Standards and Overall Equipment Effectiveness (OEE): Gain insights into how Europlacer leverages IPC CFX® standards to enhance equipment effectiveness and streamline production processes.

The Europlacer team, alongside key industry leaders, will be on hand throughout the event to provide expert guidance and support to attendees.

Secure your spot for the International Open Days at: https://europlacer.com/open-days-international-2024/.

Join Europlacer’s High-Mix Productivity Open Days for a unique opportunity to optimize your manufacturing processes and stay ahead in today’s competitive market.

europlacer.com

The SMTA is pleased to announce the technical program for the Counterfeit Parts & Materials Symposium. Co-organized by SMTA and the Center for Advanced Life Cycle Engineering (CALCE), the event will be held June 25-27, 2024 in Hyattsville, Maryland at the College Park Marriott Conference Center.

The technical program includes two policy-focused keynote presentations covering the use of trusted demand and microelectronics acquisition policy. Other sessions will consist of law and policy, detection methods, applications of machine learning and AI, standards development and adoption, and continued evolution of the supply chain.

Ezra Hall, Senior Director of Aerospace and Defense Business at GlobalFoundries, will provide the opening keynote presentation on Tuesday, June 25, 2024. Hall’s presentation is titled, “Securing Our Future – Combating Counterfeit Semiconductors with Trusted Manufacturing Demand.”

Michael Fritze, Ph.D., Senior Fellow at the Potomac Institute of Policy Studies, will keynote the second day of the symposium with his presentation, “Microelectronics Acquisition Policy of the US Government.”

To conclude this symposium, there will be two professional development courses to choose from. On Thursday, June 27, the courses will be presented from 8:30 a.m. – 5:00 p.m. Diganta Das, Ph.D., CALCE, University of Maryland, will instruct the course titled, “Use of Component Documentation and Supply Chain for Counterfeit Avoidance.” The second course, titled “Counterfeit Parts Detection Using SAE AS6171”, is instructed by Michael Azarian, Ph.D., CALCE, University of Maryland.

Registration for this event is now open. Discounted rates are available by registering by Friday, May 24. Access to the two-day symposium and professional development courses are included in the Full Access Conference Package, but there are other registration packages available on the registration page.

For logistics questions, contact Karlie Severinson, please call +1-952-920-7682 or email karlie@smta.org. For questions about the program or presentations, contact Diganta Das, diganta@umd.edu or call 301-467-3040.

For more information about the symposium, visit https://smta.org/mpage/counterfeit/.

The SMTA is excited to announce the technical program for the Wafer-Level Packaging Symposium. The symposium will be held February 13-15, 2024 at The Hyatt Regency San Francisco Airport in San Francisco, California.

The technical program includes over 25 expert speakers who delve into wafer-level packaging advances, 3D wafer-level integration, advanced packaging inspection, materials innovation, fan-out wafer-level packaging and manufacturing excellence. The program features presentations from leading companies including Intel Corporation, KLA Corporation, Department of Defense, and more. View the full technical program here.

Additionally, the technical program features two keynote presentations. On Tuesday, February 13, 2024, Manish Dubey, Ph.D., AMD, will present, “Advanced Packaging: Key Enabler for AI.” On Wednesday, February 14, 2024, Benjamin S. Cook, Meta, will present, “Wafer-Level Fan Out Technology Options to Realize High-Performance AI Enabled Augmented Reality (AR) Wearable Devices.” For more information, click here.

The symposium will culminate with two professional development courses on Thursday, February 15, 2024. The first course, “Polymers for Wafer-Level Packaging,” will be instructed by Jeff Gotro, Ph.D., InnoCentrix, LLC, from 8:30 am – 12:00 pm (PST). Tom Dory, Ph.D., Fujifilm Electronic Materials, will instruct the second course, “Package Assembly Processes and Technology,” from 1:00 pm – 4:30 pm (PST). Access to the courses is included in standard registration. For more information, click here.

Registration for this event is open. Click here to register. Discounted rates are available by registering on or before January 12, 2024. All presentations, professional development courses and events open to attendees are included in registration.

For more information about the Wafer-Level Packaging Symposium, please contact Karlie Severinson at karlie@smta.org or +1-952-920-7682.

SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Long Island In-Person Technical Meeting taking place on May 31 at Zebra Technologies in Holtsville, NY. Timothy O’Neill, AIM Solder Director of Product Management, will be presenting.

Mr. O’Neill has 25 years of industry experience and is a Certified IPC Specialist. His responsibilities include developing product and technical information; he is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA. At this event, he will be speaking on the following:

Assembly Challenges & Solutions for M0201, 08005, and Micro/MiniLED

Processing solder paste using Type 6 and finer powders requires a thorough examination of current materials, equipment, and processes to ensure success. In this presentation, AIM’s Director of Product Management will share practical information about the implementation requirements of Type 6 pastes as well as lessons learned in assisting clients in preparing for an inevitable change in how PCB are assembled today and in the future.

Registration for this event is free of charge courtesy of the Long Island SMTA Chapter and available online through May 29.

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit aimsolder.com.

The in-house Technology Days event is a tradition at Rehm. Yet this year it reached a new level. On the occasion of its 33rd anniversary Rehm invited hundreds of customers, partners, employees and press representatives from all over the world to the company’s Swabian headquarters in Blaubeuren on 26 and 27 April 2023. Under the motto “Be smart – take part”, a wealth of topics ranging from current research, practice and user-oriented workshops awaited the visitors, from the art of sustainable electronics manufacturing, connectivity and networking to smart automation and artificial intelligence.

Rehm has always used Technology Days as a platform for highlighting and discussing the sometimes rapid advances and developments in the electronics industry. Thus, all participants were again invited to discover new trends and be inspired by innovative ideas. The main focal points of the event were therefore knowledge transfer and exchanging of experiences, an offering that was readily taken up by the guests.

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.

Bringing together government agencies, the Defense Industrial Base (DIB) and advanced packaging and assembly providers, the workshop will focus on efforts to onshore advanced packaging and identify newly created programs to address U.S. Government and Defense requirements critical to microelectronics assembly and packaging supply chain onshoring.

The workshop will feature two days of focused sessions by invited speakers, a panel discussion, and a variety of networking opportunities.

Keynotes include:

• “CHIPS” presented by Eric Lin, U.S. Department of Commerce
• “DPA/Title III and ICAM/IBAS Activity” presented by Anthony Di Stasio, Office of the Under Secretary of Defense (A&S)  
• “Next Generation Microelectronics Manufacturing (NGMM)” presented by Carl McCants, Ph.D., DARPA
• “DoD ME Commons” presented by Dev Shenoy, Ph.D., Office of the Undersecretary of Defense and Director of the Defense Microelectronics Cross Functional Team

The event will kick-off on Monday, July 10 with a pre-program day with two-hour professional development courses and working group sessions addressing a variety of topics relevant to the onshoring of advanced packaging.

“Our message to policymakers is that building a more robust, domestic ecosystem for advanced electronics will require a few key policy decisions: investment in advanced packaging capacity and research and development, supply chain partnership promotion and strategic decisions on what we are building and for whom,” said Matt Kelly IPC chief technical officer and member of event organizing committee. “This workshop brings all the important players to the table – policy makers, the Defense Industrial Base, and commercial suppliers – all who have a goal to improve on advanced packaging and assembly onshoring strategies.”

For detailed information on the agenda, speakers or to register for the “On-Shoring Advanced Packaging and Assembly” workshop, visit http://www.imaps.org/onshoring.

About IPC
IPC (IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,000+ member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, industry intelligence and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry.

About IMAPS
IMAPS (imaps.org) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Worldwide, IMAPS offers educational and marketing opportunities for industry professionals, packaging organizations, and students through technical conferences and workshops, professional development courses, a microelectronics packaging research library, local chapters and exhibitions. The Society encompasses a wide-range of technologies critical to microelectronics assembly and packaging, including: on-shoring, heterogenous integration, fan-out wafer level packaging, 2.5D/3D technologies, system-in-package, photonics/optical, power packaging, CPI, package design/modeling, interconnects, wire bonding, flip chip, MEMS, sensors, packaging for 5g/6g, RF/wireless, signal/power integrity, advanced materials, substrates and more.