Fan-Out Packaging: Powering the AI Era

The AI revolution continues to push the boundaries of computing power, driving the demand for high-performance AI chips, which in turn is accelerating innovation in advanced packaging. The fan-out process is shaping the future of semiconductor manufacturing, and ASMPT is at the forefront of this trend with its high-density Fan-Out Panel-Level Packaging (FOPLP) solution designed for 2.5D, fan-out, and embedded packages. NUCLEUS XLplus is precisely engineered to meet SEMI 3D20 standards, and it delivers exceptional accuracy on SiP bonding and flexibility in the fan-out process. Capable of handling extra-large substrates up to 600 x 600 mm, the solution supports a wide range of packaging configurations, from flip-chip to direct die attach, which exemplifies ASMPT’s dedication to pioneering technology and innovation in the rapidly evolving advanced packaging industry.

Smart Automotive Solutions: Driving the Future

AI is widely adopted by electric vehicle manufacturers for advanced driver assistance systems, autonomous driving features, and predictive maintenance, enabling enhanced performance, safety, and efficiency. To meet the dynamic needs of the automotive sector, ASMPT will present a range of Smart Automotive solutions tailored for the industry, encompassing sensing tech, power management, connectivity, infotainment, and more. ASMPT will also present the SiC power and advanced display solution, empowering EV manufacturers to improve quality, reliability, and efficiency in their production operations.

• POWER VECTOR – a die-tacking solution designed for Ag/Cu sintering in automotive power modules, offering strong bonding forces up to 588 N and process versatility. Coupled with ASMPT’s SiC power solution, manufacturers can create robust modules with enhanced electrical and thermal characteristics.
• VORTEX II – designed explicitly for Mini LED Advanced Displays, efficiently handling Mini LED assembly and offering high-speed performance, exceptional precision, and innovative Zero-Delay XY-auto-correction, tending to transform visual experiences in modern vehicles with enhanced display quality and performances.

Intelligent Factory: Elevating Digital Transformation to New Heights

As the premier supplier of cutting-edge equipment and technological processes for the electronics industry, ASMPT enables electronics manufacturers worldwide to establish smart factories, championing automation and digitalisation. Through AI Enablement with machine learning algorithms incorporating the 4M framework (Man, Machine, Materials, Method), ASMPT solutions offer decision automation and optimisation, seamlessly integrating all operational levels from individual machines to production lines, factories, and enterprises. ASMPT’s comprehensive smart manufacturing solutions include SkyEye, the ecosystem for smart semiconductor manufacturing, and Intelligent Factory solutions, alongside its innovative SIPLACE placement and DEK printing solutions, as well as the modern Manufacturing Execution Systems (MES) from Critical Manufacturing will be displayed at SEMICON Taiwan. Together, this dynamic platform of advanced technologies will illustrate the latest automation and Digital Transformation advancements.

“ASMPT’s presence at SEMICON Taiwan 2024 reflects our commitment to leading the industry with our developments and providing innovative solutions for semiconductor and electronics manufacturing. ASMPT will showcase its latest innovations in advanced packaging, smart automotive solutions and smart manufacturing, highlighting its leading role in semiconductor and electronics manufacturing technology. This will further strengthen our collaboration with our customers and partners and reinforce our role as a trusted industry leader that increases productivity, efficiency and competitiveness, “ reassures Joseph Poh Tson Cheong, Senior Vice President at ASMPT.

About SEMICON Taiwan 2024, please visit the official website: www.semicontaiwan.org.

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Technological change has been progressing ever more rapidly for years and is having a major impact on the world of work. Advances in the areas of digitalization and Artificial Intelligence (AI) are creating new opportunities: for example, work processes can be automated as well as accelerated and new innovations can be implemented. However, these changes also bring new challenges: many companies are finding it increasingly difficult to find suitable skilled workers with the necessary skills and knowledge to meet the demands of modern industry. The consequences of this shortage of skilled labour are manifold: production delays, an additional workload for the existing workforce, financial losses and reduced competitiveness.

In this context, training and further education programmes are becoming increasingly important. Rehm Thermal Systems, a global manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems and numerous customized special systems for the electronics industry, recognized the importance of lifelong learning at an early stage and actively invested in the development of its own employees and customer employees in order to successfully meet the challenges of the future. And its success proves it right: as in previous years, some user trainings can no longer be booked for the current year.

The “new” Rehm Academy

In order to be able to further expand the portfolio in the coming years and counteract long waiting times, the company has decided to move the Rehm Academy to a larger adjoining building. With over 800 m² spread over two floors, the new premises at the company headquarters in Blaubeuren-Seissen offer optimal conditions for practical learning: five training rooms with modern equipment and two machine rooms with different Rehm systems. The offer includes user trainings as well as course solutions in the area of software.

User trainings – practical and application-orientated

The user trainings teach both theoretical content from the field of process technology and practical skills relating to operation and maintenance. The trainers always focus on the individual process requirements and work scenarios. This guarantees that the customer receives optimum support for the specific requirements of production. Customized user trainings are also available on request at the customer’s premises.

The Rehm Academy currently offers one- or two-day user trainings for various systems (Vision Series [with vacuum option], Condenso Series, Protecto Series and RDS Drying Systems). The training courses can be booked for users in different roles.

Expertise for modern industry

Industrial companies are faced with the challenge of optimizing their processes, increasing efficiency and at the same time reacting flexibly to market changes. Software solutions play a decisive role here. They not only enable the automation of processes, but also provide valuable insights through data analyses and support decision-making at all levels.

Due to the expansion of the Rehm Academy in terms of space and personnel, new software training courses on the following topics can be offered from September:

ViCON / six hours of face-to-face training

With ViCON, Rehm Thermal Systems has designed and realized software that meets all the requirements of modern, networked and, above all, future-oriented electronics production: the ViCON software impresses with a variety of analysis tools, the highest quality and the ability to access the software with different devices. The software is also intuitive to use thanks to the use of touch elements and gestures. All messages, commands and parameters are visible in the main mask with machine view.

The training offered looks at the topic of disaster recovery and examines in detail backup solutions, system recovery after replacing a defective SSD, importing an image backup as well as importing and exporting a ViCON backup.

Hermes / one hour of face-to-face training

Efficiency, simplicity, adaptation to demand and networking are the keywords that characterize today’s industry. In a smart factory, it is essential that the entire production process is networked and that all process data and assembly data can be accessed at any time: “the Hermes Standard” is the successor to the SMEMA interface. It ensures that important assembly information is reliably transmitted from machine to machine (M2M) and to higher-level systems – regardless of the manufacturer of the systems in an SMT line.

The training course of the Rehm Academy deals with the basics, functionality, operation and advantages of this interface as well as the variants and options.

MES mit ROI oder CFX / four hours of face-to-face training

In the age of digitalization, manufacturing companies are increasingly relying on process-oriented production management systems (MES). These systems continuously collect all operating data along the material flow for an individual production line and make it available to the higher-level enterprise resource planning system (ERP) via an interface (ROI/CFX).

This course covers the basics and importance of MES systems and the ROI/CFX standard in modern manufacturing. It also looks at how MES systems interact and exchange data with other Industry 4.0 components, including ROI/CFX. And it deals with methods for collecting, processing and analyzing production data through MES, transmission via ROI/CFX, the use of MES and ROI/CFX to optimize manufacturing processes and increase production efficiency and the use of MES and ROI/CFX to improve product quality and compliance with industry standards.

You are interested or have questions?

As part of this year’s Technology Days, Rehm Thermal Systems is offering guided tours through the new Rehm Academy premises on 11 and 12 September 2024. All important information about the event and registration can be found online at www.rehm-group.com/technology-days.html.

Alternatively, you are welcome to contact Ms Annalena Weiss, Organizational Manager Rehm Academy, on +49 7344 9606-433 or by e-mail at a.weiss@rehm-group.com.

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) has been placed in the “Gartner^® Hype Cycle for Revenue and Sales Technology, 2024” as a Sample Vendor in the “Composite Applications” category. “Gartner Hype Cycles are graphic representations of the maturity, relevancy and adoption rate of emerging and mainstream innovations. CIOs and IT leaders can use Hype Cycles and associated Priority Matrices to strategize roadmaps for investing in the right innovations at the right time.“

Fit for the future with composable architecture

In the “Hype Cycle for Revenue and Sales Technology, 2024”, iTAC is positioned as a Sample Vendor in the “Composite Applications” segment. We believe that iTAC is therefore setting a good example in this area.

“Composable stands for a modern IT architecture concept in which systems and applications are composed of modular, reusable and independent components. These components can include different types of software modules, microservices, containers or applications and can be developed using different technologies and platforms. They are designed to be easily combinable, interchangeable and scalable in order to be able to react quickly to business requirements and market changes. These trends and the continuing digitalization and automation in the manufacturing industry are driving the development of MES/MOM systems.

The switch from monolithic systems to microservice-oriented architectures therefore enables greater independence, flexibility and agility,” explains Martin Heinz, board member of iTAC Software AG.

The Manufacturing Operations Management solution iTAC.MOM.Suite works according to this principle, setting new standards in the manufacturing industry. The MOM combines Manufacturing Execution System (MES) functions with real-time solutions for controlling, optimizing and forecasting production processes. It has all the necessary functions for networking and automating processes. The open and service-oriented architecture simplifies data exchange and forms the basis for seamless integration into existing platform concepts. The microservices approach makes it easy to add new functionalities as required.

Martin Heinz says: “We think the recognition in the Gartner report confirms that our production management system is fit for the future.“

Read the full report here: https://www.itacsoftware.com/de/media/analysten-reports/gartner-report

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As EMS and OEM companies continue to transition from traditional methods to digital solutions, CalcuQuote has been at the forefront of this transformation. In its 10^th year, the company has revolutionized the industry by providing comprehensive software solutions that move away from the cumbersome and error-prone Excel files towards more efficient and scalable digital platforms.

CalcuQuote’s Material Supply Planning (MSP) solution is designed to help electronics companies reduce inventory, optimize supply chains, and free up cash flow. A prime example of the transformative power of MSP can be seen in the successful collaboration between CalcuQuote and S and Y Industries.

S and Y Industries, facing significant supply chain challenges amid a global parts shortage, transformed its procurement process with CalcuQuote’s Material Supply Planner (MSP). This implementation resulted in a 68% reduction in missing kits, a 35.6% decrease in inventory levels, and a dramatic increase in processing capacity from 800 to 6,000 demand lines per month, saving 1,000 hours on manual tasks. Additionally, S and Y resolved cash flow issues, enhanced supply chain visibility, and boosted employee morale, positioning itself for continued growth and efficiency improvements.

For the past decade, CalcuQuote has been committed to pushing the boundaries of what’s possible in the electronics industry. Their innovative supply chain solutions have helped countless companies streamline their operations, reduce costs and improve overall efficiency. As CalcuQuote celebrates this milestone, the company is more dedicated than ever to continuing their mission of empowering electronics companies with state-of-the-art digital tools.

Visit CalcuQuote at the SMTA Long Island Expo & Tech Forum to discuss their cutting-edge solutions and learn more how their MSP can revolutionize supply chain operations.

About CalcuQuote

CalcuQuote provides software solutions that optimize supply chain operations across sourcing, purchasing, quoting, and supplier collaboration, serving as a strategic partner to EMS companies, OEMs, and component suppliers. The CQ platform offers access to real-time supply data and seamless API integrations, ensuring end-to-end management that significantly improves the speed, accuracy, and efficiency of supply chain processes. Founded in 2014, CalcuQuote now serves hundreds of companies across the globe. Committed to reinventing the supply chain, CalcuQuote establishes its platform as an indispensable system for the future of the electronics industry. For more information, visit www.calcuquote.com.

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“I am very pleased to add Univertools to our sales channel network. I’ve known the founder of Univertools, Andres Luna, for more than 15 years and we’ve had the pleasure of collaborating on a few key projects in the past,” commented Mitch DeCaire, Sr. Director – Business Development at Cogiscan. “Andres and his team have built a reputation for having the gumption to take on daunting production challenges and will further ballast Cogiscan’s customer footprint in key geographic areas of Mexico.”   

Established in 2008, Univertools re-sells a wide range of SMT solutions for electronics manufacturers within Mexico – with specific support in the key regions of Jalisco, Aguascalientes, Guanajuato, Queretaro, San Luis Potosi, Tamaulipas, Nuevo Leon and Chihuahua.

Univertools covers all aspects of the manufacturing lifecycle extending beyond selling SMT equipment to include engineering services and repair support. With a mission to elevate the manufacturing process, Univertools is renowned for its close partnerships with clients, offering precisely customized solutions that effectively tackle the unique challenges faced by each customer.

“We believe this partnership will significantly benefit Mexican manufacturing companies by providing them with the tools they need to achieve higher levels of operational efficiency and product quality,” commented Andres Luna, General Manager at Univertools. “Cogiscan’s commitment to vendor neutrality and seamless connectivity solutions enables manufacturers to adopt advanced technologies effortlessly, while their robust analytics and comprehensive data management empower companies to make better decisions, cut waste, and boost productivity.” 

About Cogiscan

Cogiscan provides comprehensive and modular factory digitalization solutions tailor-made for electronics manufacturers. Cogiscan’s applications enable machine connectivity, process control and traceability, as well as advanced factory insights – from the shop floor all the way to the enterprise level. Trusted by electronics manufacturers in stringent quality industries, the Cogiscan platfom helps to meet the specific standards for Medical & BioTech (ISO 13485), Automotive (IATF 16949), and Aerospace/Defense (AS9100). With installations around the globe, Cogiscan’s solutions have helped to transform and optimize manufacturing operations in over 450 factories. Together with its parent company iTAC Software AG, Cogiscan is part of Dürr Group’s Digital Factory. The Dürr Group is one of the world’s leading mechanical and plant engineering firms with particular expertise in the technology fields of automation, digitalization, and energy efficiency. Its products, systems, and services enable highly efficient and sustainable manufacturing processes. For more information, please visit cogiscan.com. 

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According to Jamie Maughan, the Managing Director of Incap UK, this upgrade is not only preparing the production lines for future demands but also integrating advanced software and machine capabilities that will drive efficiency improvement within the manufacturing cycle. “This investment also improves our SMT operational efficiency, production quality, and site technology. Additionally, it allows for energy savings through real-time intelligent machine monitoring, helping us better serve our current and future customers”, Maughan explained.

The current phase focuses on upgrading the first line and will be followed by the second line over the course of the year, using identical advanced machinery and software. This strategic update is designed to ensure each stage is optimized before continuing expansions.

The enhancements will enable improved data acquisition capabilities, combining cutting-edge Industry 4.0 architecture for advanced interfacing with future ERP systems. The use of intelligent technologies is instrumental in achieving these improvements and opens several other opportunities. Incap’s continued collaboration with Panasonic to upgrade technology to new levels of operational excellence reinforces Incap’s strong position in the electronic manufacturing industry.

“This investment marks an important milestone in our strategic technology roadmap”, Maughan added. “It reflects our commitment to reducing environmental impact and improving operational efficiency, while continuing to provide high-quality, flexible, and agile services to meet the growing demands of our customers.”

Incap’s factory in UK, based in Newcastle-under-Lyme, provides full turn-key product supply including PCBAs, electro-mechanical assembly, cable and wire harness assembly alongside a dedicated standalone rapid prototyping facility (Fast Track) and maintenance, repair and overhaul services (MRO). The factory has 4,400 square meters of total floor space and has experience in manufacturing since 1974, including over 20 years of experience in the defence, security and aerospace markets.

To learn more, visit www.incapcorp.com.

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Performance

Leveraging over 30 years of experience in innovative Automated Optical Inspection (AOI) design, the MVP Aurora system is engineered to deliver exceptional inspection capabilities through dual technologies. For topside package inspection, the system features high-resolution telecentric optics, enabling precise measurement of device dimensions, inspection of part markings, and thorough surface examination. For the underside inspection of balls and leads, MVP’s shadow-free 3D technology ensures accurate coplanarity and positional measurements.

Designed to provide our smallest footprint, the MVP Aurora employs a Pick-Inspect-Sort methodology for comprehensive multi-sided package inspection. After inspection, defective parts are placed in a defect tray, while good parts are returned to their original tray. This process ensures that the stack of parts loaded for inspection contains only devices that have met all inspection criteria.

MVP’s Aurora system excels in inspecting a wide range of package types, including: Ball Grid Arrays (BGAs), Quad Flat Packs (QFPs), Thin Quad Flat Packages (TQFPs), Chip Scale Packages (CSPs), Wafer-Level Packages (WLPs), Quad Flatpack No-Leads (QFNs), Bump Chip Carriers (BCCs), Land Grid Arrays (LGAs), and more. This makes it an ideal solution for both Outgoing Quality Control (OQC) and Incoming Quality Control (IQC).

Software

MVP’s ePro software facilitates rapid and efficient recipe development, guiding users through the program generation process to quickly create inspection strategies for various devices. To expedite development, data can be imported from CAD, Gerber, or DXF files. The iPro software employs advanced algorithms to perform all inspection tasks with high precision.

Traceability

The MVP Aurora system supports SECS/GEM with SEMI E142 mapping and offers MVP’s End Lot Summary Reports (ELSR) for exporting tray data. Additionally, MVP’s AutoData SQL system provides robust traceability by saving all parametric and attribute data for products. The database system can also store device images on an individual basis, enhancing traceability and quality control.

To learn more, visit www.visionpro.com.

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