PEMTRON, an inspection equipment developer and supplier, is excited to announce its participation in the SMTA Chihuahua Expo & Tech Forum. The event is scheduled to take place Thursday, Aug. 15, 2024 at the Hotel Sheraton Soberano Barranca Del Cobre in Chihuahua, Mexico. PEMTRON will be focusing on its revolutionary D2 (Dual Lane & Dual Head) Series.
D2 Series: A Benchmark in AOI and SPI Technology
The PEMTRON D2 System represents the new standard of innovation in the fields of Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI). The introduction of dual lanes and dual heads, which allows the simultaneous inspection of two different PCBs, sets a new benchmark for inspection technology. This groundbreaking capability enables the system to inspect diverse boards concurrently, such as 8way + 4way, 12way + 4way, and 8way + 8way configurations, showcasing unmatched efficiency and flexibility.
Key Features of the D2 System:
- Dual Lanes & Dual Heads: Simultaneous inspection of two different PCBs, enhancing productivity and throughput.
- Advanced Configurations: Capable of inspecting 8way + 4way, 12way + 4way, and 8way + 8way board configurations, setting a new industry standard.
- User-Friendly Interface: The system boasts a sophisticated design with a user-friendly GUI, built-in library management system, and an offline real-time debug station.
- Customizable System: Allows adjustments based on various inspection objects, reflecting thoughtful and well-engineered design principles.
- Reliable Performance: Engineered for consistent and dependable performance with tele-centric lenses, high-speed CPUs, and advanced image processing capabilities.
PEMTRON’s local team of experts will be on hand to answer questions and discuss how the company’s innovative solutions can meet the unique needs of various industries.
About PEMTRON
Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS), FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).
