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Ventec’s Value-Added Equipment Division Welcomes Marc Ladle as Project Manager
Ventec is pleased to announce the appointment of Marc Ladle to the position of Project Manager for Ventec Giga Solutions, its value-added PCB equipment...
Indium Corporation’s New Type 6 Jetting Solder Paste Hits Market
Indium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M is a no-clean, halogen-free,...
KYZEN Welcomes Michael McCutchen as Director of Global Sales
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce the hire of Michael McCutchen as Director of Global Sales.
McCutchen...
QP Technologies™ Expands Die Preparation Business
QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has added a state-of-the-art dicing saw to its manufacturing...
Celebrating 25 Years of Excellence: AIM Solder’s Mexico Facility Marks a Milestone
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to celebrate the 25th anniversary of AIM-Soldadura de...
Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH
Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J. Wagner as its new General Manager. With a career spanning over...
Henkel introduces Loctite 3D MED3394, a novel solution for post-sterilization durability
With the introduction of Loctite 3D MED3394 Henkel has launched a further innovation within its growing portfolio of medical-grade resins for 3D printing. The...
AIM Solder Promotes Chris Matthews to Business Development Manager
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the promotion of Chris Matthews to...
Heraeus Successfully Defends Patent for Metal Sintering
Heraeus Electronics GmbH & Co KG (“Heraeus”), a global leader in electronic materials and technologies, announces the successful defense of its key European patent...
SHENMAO Develops Thermal Fatigue-Resistant Solder Paste PF918-P250 for High-Reliability Requirements
SHENMAO Technology proudly announces the development of its new thermal fatigue-resistant solder paste, PF918-P250. Designed to meet high-reliability requirements, PF918-P250 offers advanced features and...
